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Mu Yang couldn't sleep, so he began to study the production of single crystal silicon rods and wafer fabrication.

He does not want to be restricted from supplying monocrystalline silicon rods by international giants from the beginning, and independent research and development and production can also ensure quality.

For example, if he needs 12-inch wafers, he must first have 12-inch monocrystalline silicon rods. The raw material monocrystalline silicon rod manufacturers will not sell them to Xinghai Group. Generally, they are sliced into wafers, and then processed wafers are sold to chip factories. , or make their own chips.

6-inch and 8-inch wafers are easy to get, but 12-inch wafers are more difficult, no matter when, they are in short supply.

If Xinghai Group needs larger-sized wafers, other monocrystalline silicon ingot manufacturers cannot produce them. In the final analysis, they have to develop and produce them independently.

Therefore, if you don't want to be sanctioned for chips in the future, you have to start with single crystal silicon rods and wafers.

Muyang opened the achievement point store and began to search for the technology of monocrystalline silicon and wafers.

He has searched and learned about this knowledge before, but he has not purchased it.

After a while, according to his previous plan, among dozens of monocrystalline silicon and wafer technologies, he chose a technology that was more suitable for Xinghai Group and the contemporary background.

A 12-inch monocrystalline silicon rod and wafer production method with low energy consumption and high efficiency

[Technical introduction: The new CZ single crystal growth method is adopted, and the arc furnace, quartz crucible, graphite heater, single crystal furnace, argon gas production system, thermal field, slicer and other production equipment with lower energy consumption are used to purify the raw materials. , polysilicon melting, spinning and drawing out single crystal silicon, single crystal silicon rods and other process processes to ensure less polysilicon impurities, higher argon purity, and new processes to ensure that single crystal silicon rods are produced with less impurities in the production process, Lower energy consumption and faster growth of single crystal silicon rods. Using more excellent slicer and grinding equipment can reduce the fragmentation rate, cutting loss, as well as chipping, scratching and other losses, and more wafers can be obtained per unit length of single crystal silicon rod.

It has the following advantages: low energy consumption, ultrhigh purity single crystal silicon rod, lower cost of using argon gas, faster growth efficiency of single crystal silicon rod, better silicon toughness and less brittleness, excellent wafer raw material processing method]

[CZ-G12-01: world-class level, on par with the technology of the current world giants, demand achievement points: 100]

[CZ-G12-02: the world's top level, about 4-8 years ahead of the most advanced technology in the current laboratory, demand achievement point: 250] Muyang compared the two versions of the technology and found that the equipment of the CZ-G12-02 version technology is also It can be produced, but the investment cost is higher, and most importantly, it consumes more achievement points. The 01 and 02 versions belong to the same type of technology. If you buy the 01 version technology, you only need to spend another 150 points to get the 02 version technology. Error free update@

However, after the technology upgrade, the original equipment is not necessarily applicable, it is better to be in place at one time.

Moreover, this technology is not only a single crystal silicon generation technology

Also included are techniques for cutting monocrystalline silicon rods into wafers and processing them into final wafers, excluding chip fabrication and chip design, of course. In the end, Muyang bought the CZ-G12-02 version of the technology.

To buy this technology, the main requirement is that the semiconductor technology skill reaches level 7. Mu Yang has raised the semiconductor technology to level 7 early, and other skills can also be satisfied, and can be purchased directly.

After a few minutes.

Muyang has absorbed this technology and has a better understanding of wafer production.

For example, the most critical single crystal furnace equipment, Muyang calls it XH1200 single crystal furnace, this equipment can use a 40-45 inch thermal system, the maximum melt volume is 1200kg, and it can pull 12 inches to 14 inches of single crystals silicon rod.

If a 14-inch monocrystalline silicon rod is produced, the purity of the wafer is lower, and the optimal size is 12 inches.

But owning this equipment~www.mtlnovel.com~ has already indicated that Xinghai Group has the level of mass production of 14-inch wafers.

The maximum melt volume is 1200kg, which is not much improved from the mainstream 12-inch single crystal furnace's melt volume of 1000kg. This is not important. If you want to make it bigger, you can make the equipment bigger, but the post-processing is very troublesome. Energy consumption will be greater, not necessary.

How long is a 1000kg 12-inch monocrystalline silicon rod?

The density of single crystal silicon is 2.32-2.34 grams per cubic centimeter, if it is 12 inches, that is, the diameter is 3. (This chapter is not over!)

Chapter 398 Another world number one, CZ-G12-02

The area is 706.! The weight of single crystal silicon per centimeter of thickness is 1646 grams, or 1646KG!

One meter is 164.46KG. If the loss is not considered, one ton of molten material can produce a single crystal silicon rod with a length of up to 6 meters.

But in fact, it is generally very powerful to be made four or five meters long, and it will be more troublesome to process if it is too long.

Of course, it has the advantage that the utilization rate is higher. This is because the end of the single crystal silicon rod is not flat, but a tapered surface, so there is a waste of material.

Of course, this loss is nothing compared to the entire single crystal silicon rod.

In addition to the diameter size of single crystal silicon, there is also a core indicator, that is, the purity of single crystal silicon!

General wafer purity requirements: 99.999% or more.

In fact, the manufacturing process of wafers is not very complicated. The difficulty lies in the fact that semiconductor products have high requirements on the purity of wafers, and the actual purity needs to reach 99.999999999% (9 9s) or more.

Some people may ask, why achieve such absurd purity?

Isn't 99.999% not enough?

Purity = mass / total mass x 100%